Kyocera Doubles Semiconductor Outlay To $9.8B: Report
Author: Anusuya Lahiri | December 27, 2022 10:22am
- Kyocera Corp (OTC:KYOCF) (OTC:KYOCY) looked to expand its investment in semiconductors, increasing total capital investment and research and development expenditure to 1.3 trillion yen ($9.78 billion) over the three fiscal years through March 2026.
- Kyocera doubled the amount spent during the previous three years to March 2023, Nikkei Asia reports citing President Hideo Tanimoto.
- Kyocera will also fundraise by pledging its KDDI shares as collateral for the first time while borrowing up to 1 trillion yen.
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- Kyocera eyed aggressive investments in areas including ceramic components betting on near-term chip market expansion.
- Kyocera eyed up to 900 billion yen in capex, double the amount over the past three years, and plans to spend 400 billion yen on R&D, up by 60%.
- In Kagoshima prefecture in southern Japan, Kyocera invested 60 billion yen to construct a new semiconductor package production facility.
- In Nagasaki, Kyocera constructed its first new domestic plant in about 20 years since the start of operations at its Ayabe factory in Kyoto.
- Tanimoto said Kyocera earmarked up to 100 billion yen to produce ceramic components and semiconductor packaging, with the new plant set to begin operating in 2026.
- The area bears proximity with other chip plants like Sony Group Corp (NYSE:SONY), an expressway interchange, and other transportation infrastructure.
- In Vietnam, Kyocera expanded factories producing multifunctional machines and quartz components.
- The report added that Kyocera would borrow from banks partly by using its KDDI Corp (OTC:KDDIY) (OYC: KDDIF) shareholdings as collateral.
- Kyocera holds 15% of KDDI's issued shares with a market value of 1.35 trillion yen.
- Depending on semiconductor market conditions, Kyocera may carry out up to 1 trillion yen in future collateralized borrowing.
- Price Action: SONY shares traded lower by 0.22% at $76.77 in the premarket on the last check Tuesday.
- Photo Via Company
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