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"The Advanced Encapsulation Capacity Of TSMC Is Booked To Whida, Ultra-Micro All The Way To Next Year" - Money.udn

Author: Benzinga Newsdesk | May 06, 2024 11:57am

https://money.udn.com/money/story/5612/7944385 (Translated)

 

AI application perianth exfoliation, two major AI giants Whida (NVIDIA), ultra-micro(AMD)Full sprint high-efficiency operation (HPC)Market, outgoing package(2330)Today, next year CoWoS and SoIC advanced packaging capacity, assist station power generation AI related business orders heat transfer.

 

The power generation height of the station is optimistic about the kinetic energy brought by AI-related applications. President Wei Zhejia repaired the visibility of AI orders and the revenue-to-income ratio at the French-speaking conference in April. Among them, the visibility of orders increased from 2027 to 2028.

 

TSMC believes that the server AI processor's contribution revenue will grow more than double this year, accounting for the company's 2024 total revenue of ten-digit low segment (low-teens) percentage, and it is expected that the annual composite growth rate of the server AI processor will reach 50%, will account for more than 20% of TSMC revenue in 2028%.

Posted In: TSM

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