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Reported Earlier, Rapidus And IBM Inks Joint Development Partnership To Include Chiplet Packaging Technology For 2nm-Generation Semiconductors

Author: Benzinga Newsdesk | June 04, 2024 02:03am

This agreement is part of an international collaboration within the framework of the "Development of Chiplet and Package Design and Manufacturing Technology for 2nm-Generation Semiconductors" project being conducted by Japan's New Energy and Industrial Technology Development Organization (NEDO) and builds on an existing agreement with IBM for the joint development of 2nm node technology. As part of the agreement, IBM and Rapidus engineers will work in collaboration at IBM's facilities in North America for R&D and manufacturing of semiconductor packaging for high-performance computer systems.

Posted In: IBM


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