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Reported Earlier, Adeia And Hamamatsu Photonics Enters Long-Term Hybrid Bonding License Agreement

Author: Benzinga Newsdesk | July 24, 2024 03:13am

This new license supplements Hamamatsu's existing license to Adeia's DBI® wafer-to-wafer hybrid bonding and ZiBond® wafer-to-wafer direct bonding technologies and follows from a prior development license between the parties that included a DBI Ultra® die-to-wafer hybrid bonding technology transfer.

Posted In: ADEA


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