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'TSMC to break ground for German fab at year-end, sources say' -DigiTimes Alert

Author: Benzinga Newsdesk | July 24, 2024 07:28am

TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production beginning as early as the end of 2027, according to sources at semiconductor equipment makers.

Posted In: TSM


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