Veeco And IBM Announce Agreement To Explore Wet Processing System For Advanced Packaging Applications

Author: Benzinga Newsdesk | August 14, 2024 09:05am

Veeco Instruments Inc. (NASDAQ:VECO) today announced that IBM selected the WaferStorm® Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco. Under the agreement, the Waferstorm Wet Processing System will be installed at facilities at the Albany NanoTech Complex in Albany, NY, where IBM and other ecosystem partners are driving leading-edge R&D in advanced packaging and chiplet technologies.

The WaferStorm system enables crucial hybrid bonding cleaning processes such as resist strip, temporary bonding strip, and pre-bond cleaning with low defectivity thresholds at 40nm and 60nm. TheWaferStorm Wet Processing System's ImmJET multi-wafer immersion and high-pressure spray technology can perform multiple processes on one flexible platform that can handle multiple wafer sizes and thicknesses with minimal hardware modifications.

Posted In: IBM VECO